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Before yesterdayUP Bridge the Gap

The UP Xtreme i14 – Leverage Meteoric AI Innovation

✇UP Bridge the Gap
By: michelle
7 June 2024 at 15:25

Leveraging the significant advancements in integrated computing provided by the new Intel® Core™ Ultra processor platform, the UP Xtreme i14 grants users increased potential for AI application development across a wider range of markets than any of its predecessors. Providing exceptional expansion alongside MIPI camera support, four 8K display outputs, and UP’s signature 40-pin GPIO, the UP Xtreme i14 is a true breakthrough for those seeking an advanced development solution.

Pre-order Now and get a free power supply via bundle purchase: https://up-shop.org/up-xtreme-i14-series.html

The UP Xtreme i14 is available for pre-order until 5th of July.

AI-Integrated SoC Architecture

The UP Xtreme i14 introduces the new Intel® Core™ Ultra processor platform to the UP catalog, benefiting from a new high-performance CPU core architecture and onboard LPDDR5. This combination enables the board to execute heavy task loads and real-time data processing with ease. The chip’s integrated CPU, GPU, and NPU provide up to 32 TOPS for advanced industrial robotics, frictionless retail, and smart healthcare, while also maintaining power efficiency. UP also institutes power limitations via CPU frequency scaling to maintain the stability of the board’s CPU temperature and voltage during operation.

Elite, Expandable Board Design

A total of four M.2 Keys support Wi-Fi, 5G, and AI acceleration module installation. Further, a plethora of interfaces suitable for a range of embedded markets, including a 40-pin GPIO, multiple LAN and USB ports, and a serial port header, offer the necessary peripheral support to develop advanced AMR and frictionless retail solutions. Additionally, a broad 9V-36V power input range facilitates the board’s deployment in industrial control settings.

Unmatched Image Quality

The UP Xtreme i14’s ability to capture and process visual data, combined with the quality of its display outputs, is industry-leading. The board’s dual MIPI camera support provides higher resolution image acquisition for real-time edge processing. A total of two HDMI 2.1 ports, DP 2.1, and one DP 1.4 via USB Type-C are all capable of achieving 8K resolution at 60Hz, leverage Intel® Arc™ graphics to deliver crystal clear imaging for AI-assisted healthcare imaging, smart retail signage, and POS solutions.

The post The UP Xtreme i14 – Leverage Meteoric AI Innovation first appeared on UP Bridge the Gap.

[Tech Update] Benchmark Testing of UP 7000 N50, UP 7000 N100 and Raspberry Pi 5

✇UP Bridge the Gap
By: michelle
6 February 2024 at 18:45
UP 7000 computing board compared with the Raspberry Pi 5 computing board.

UP 7000 benchmark, comparison with Raspberry Pi 5

In this article we are going to provide a comparison between our new UP 7000 single board computer and the latest iteration of Raspberry Pi, the Raspberry Pi 5.

Let’s have a look at the results:

Test Systems:

  • UP 7000 N50 4GB RAM
  • UP 7000 N100 4GB RAM
  • RPi5 8GB RAM

 

The Raspberry Pi 5 is powered by a quad-core Cortex-A76 processor with up to 2.4GHz, compared to the four Cortex-A72 cores found in the Raspberry Pi 4 that only reached 1.8GHz. The integrated GPU is also much improved with now including a 800MHz VideoCore VII graphics processor over the VideoCore VI graphics with the Raspberry Pi 4.

With the Raspberry Pi 4 a moderate passive heatsink or even active cooling is recommended. But with Raspberry Pi 5 adequate cooling is crucial with the higher-clocked and faster Cortex-A76 cores. For this reason, in this comparison, we will show the performance of Raspberry Pi 5 without cooling and with the optional active cooler provided by the RPi Foundation.

The UP 7000 is a credit card-sized developer board that is powered by the latest Intel® Processor N-series platform (formerly Alder Lake-N) 1. The performance is up to 1.4x improved compared to previous Intel SoC generation in single thread.

The built-in Intel® UHD Graphics Gen12, a new generation of GPU based on Xe architecture with up to 24 Execution Units, is also a powerful AI engine and available for AI inference (with FP16 and INT8 quantization support).

UP 7000 series has a standard industrial PC operating temperature range of 0~60 C, making it flexible for any applications and it comes with a proper passive heatsink to handle properly the cooling of such powerful board. It is also designed with industrial standard 12V DC power input.

With Secure Boot support and the TPM 2.0 chip on board, UP 7000 enables better security options for any project, thanks also to the support of multiple operating systems such as Microsoft Windows 10/11 and multiple Linux Distributions like Debian and Ubuntu.

 

Both Single Board Computers offer a flexible 40-pin HAT GPIO can be configured also as PWM, UART, I2C, I2S, SPI.

 

Test Setup:

Comparison Overview and Results:


Executive Summary of Result

As results of the benchmarks, UP 7000 N100 4GB had the most wins. When compared to Raspberry Pi 5, UP 7000 offers superior performance for the most common applications and use cases, including compression tests, network/server applications, cryptography, encoding/decoding, and image processing. It also provides better results for generic CPU tests, GPU, and memory tests 2.

Although UP 7000 is priced higher than Raspberry Pi 5, it offers faster performance, integrated embedded storage with multiple options (32 GB / 64 GB / 128 GB eMMC) and security features such as secure boot and TPM2.0 onboard chip 2.

UP 7000 is a versatile and powerful embedded platform that can be used from prototype to production. It is designed to reduce the effort and risks in IoT, robotics, and AI/machine vision projects for software developers, embedded engineers, and data scientists.

Check the full benchmark report at https://openbenchmarking.org/result/2402076-NE-MERGE726852

The post [Tech Update] Benchmark Testing of UP 7000 N50, UP 7000 N100 and Raspberry Pi 5 first appeared on UP Bridge the Gap.

Move UP to 13th Gen Performance Across Platform

✇UP Bridge the Gap
By: michelle
31 January 2024 at 17:44

UP Xtreme and UP Squared ranges reach new heights with the adoption of 13th Generation Intel® Core™ processors.
 

Now equipped with embedded 13th Generation Intel® Core™ processors in both palm and pocket-sized form factors, UP Squared and UP Xtreme product lines bring flexible, high-powered workload processing, and unparalleled multitasking performance to the edge in a smaller form than previously possible. 

Pushing the boundaries of performance with the 13th Generation platform, the UP Squared and UP Xtreme can take advantage of up to 14 cores and 20 threads, 1.34x faster multi-thread performance, and up to 1.25x faster CPU image classification inference performance. Moreover, the upgrade brings with it more advanced features to augment AI project performance, including a new Vector Neural Network Instruction (VNNI) to substantially boost the inferencing performance of Intel® DL Boost.
13th Generation SKUs now available!

As the standard-bearer for high-performance within the UP board range, the UP Xtreme i12 fully leverages its Intel® Iris® Xe graphics compatibility. It enables end-to-end image acquisition through carrier board-based MIPI CSI cameras and HDMI-in pin wafers, supporting up to four independent displays at resolutions of up to 4K at 60Hz. This provides users with a robust foundation for graphically intensive applications, such as AI-assisted clinical imaging and smart city projects.

Measuring a mere 85.6mm × 90mm, the UP Squared i12 is the world's smallest single-board computer powered by 13th Gen Intel® Core™ CPUs. Designed to offer flexibility for a range of projects, it not only boasts remarkable I/O density but also supports expandability for AI, Wi-Fi, and storage modules. Additionally, the UP Squared i12 is equipped with a Raspberry Pi-compatible 40-pin GPIO header, expanding its capabilities beyond the traditional barebones-style kit, enabling a wider range of functions.

The UP Xtreme i12 Edge is a remarkable high-performance embedded solution tailored for a wide range of vertical markets, including Industry 4.0, intelligent healthcare, and smart transport. Its networking capabilities are expansive, featuring dual LAN, USB 4.0, and COM ports that support RS-232/422/485, providing users with a wealth of communication interfaces for high-speed data transmission. These capabilities are further enhanced by the increased single and multi-thread performance of the latest 13th Generation platform.

From edge gateway applications to intelligent parking management solutions, the UP Squared i12 Edge is equipped with a diverse array of interfaces for connecting peripheral devices, including dual LAN and three USB 3.2 Gen 2 ports. The significant increase in inferencing performance, courtesy of the 13th Generation Intel® Core™ CPU range, combined with its substantial 128GB onboard SSD and support for expandable NVMe and SATA storage positions the UP Squared i12 Edge as a formidable choice for edge deployments.

The post Move UP to 13th Gen Performance Across Platform first appeared on UP Bridge the Gap.

The UP Squared i12 Edge – The Market-Ready Mini PC

✇UP Bridge the Gap
By: michelle
27 December 2023 at 18:24
Bring edge computing anywhere, with the most compact, versatile, market-ready Mini PC.

New UP Squared i12 Edge is a miniature system with maximum potential. Featuring 12th Gen Intel® Core™ processors, onboard LPDDR5 system memory, and extensive expansion options, the newest and smallest addition to the UP Edge System line can power remarkably sophisticated solutions across industries.
Industrial Automation and IoT Gateway

The UP Squared i12 Edge is the ideal compact solution for optimizing manufacturing processes. CNVi support via an M.2 2230 E-Key offers wireless data exchange with retrofitted factory equipment, while the high bandwidth offered by the PC’s LPDDR5 system memory allows for faster data acquisition from sensors and cameras. This enables inferencing functions such as anomaly detection for predictive maintenance to be performed by its 12th Gen Intel® Core™ processors without latency.

Parking Management

With its robust processing capabilities and AI module support through an M.2 2280 M-Key interface, the UP Squared i12 Edge is well-suited for a range of applications that depend on Automatic Number Plate Recognition (ANPR), including smart parking structures. By connecting with peripheral devices, the system can effectively monitor parking lot occupancy. Furthermore, it can transmit this information to users through high-definition displays using its HDMI 1.4b/DP 1.2 stack connector, as well as DP 1.4a via the USB Type-C port.

Toll Plaza

When a vehicle enters a toll plaza, the system's advanced processing and inferencing capabilities can identify key parameters such as vehicle type and distance covered. This data can then be analyzed to determine the appropriate toll payable. Further demonstrating its suitability is the PC’s blend of ample onboard and expandable storage. Such features facilitate the collection, processing, and analysis of data directly on the edge. Additionally, this data secured through the hardware-based encryption of onboard TPM 2.0.

AGV

12th Gen Intel® Core™ processors enable precise path-planning, a crucial aspect for applications like automated guided vehicles (AGVs). Further, onboard LPDDR5 system memory ensures rapid data transmission at the edge. This UP Squared i12 Edge is also equipped with interfaces that include dual LAN and three USB 3.2 Gen 2 ports in a fanless chassis, with compact dimensions measuring just 130mm x 94mm x 68mm. This compact powerhouse holds the potential to emerge as a sophisticated and energy-efficient solution for AGV purposes.

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The post The UP Squared i12 Edge – The Market-Ready Mini PC first appeared on UP Bridge the Gap.

UP – Comprehensive Platforms for Hailo-8™ M.2 2280 AI Module Integration

✇UP Bridge the Gap
By: michelle
7 November 2023 at 15:29

A winning combination for a new era of edge computing.
Get yours now on UP Shop!
 

The Hailo-8™ M.2 2280 AI module brings AI functionality to the edge. Equipped with a comprehensive library of inference models and software development frameworks, users can flexibly build and scale elite deep learning applications across the Industry 4.0, smart city, and automotive markets. With 26 TOPS and record-breaking low typical power consumption of 2.5W, the Hailo-8™ M.2 2280 AI module offers a cost-efficient yet high-performance means of shifting real-time AI task execution to the edge. UP brand channels the Hailo-8™ M.2 2280 AI module’s capabilities via precisely designed developer boards with onboard Intel® processors.
Why Choose UP?
Faster to Market

With a portfolio of platforms boasting a diverse range of processors and interfaces, solutions can be tailored to specific project needs using existing UP products. Intel Atom®-based SKUs can harness the 26 TOPS of inferencing performance offered by the Hailo-8™ module while maintaining efficiency. Alternatively, advanced UP platforms allow you to combine more powerful CPUs with multiple Hailo-8™ modules to scale up AI performance.

Future-Proof Software

UP not only provides a hardware foundation with which to build applications but also accommodates the growing sophistication of software stacks by guaranteeing support for easy and painless software upgrades. With the Hailo-8™ module’s compatibility with open-source machine learning frameworks and the substantial resources offered by the UP Community, your project can stay on the cutting edge of innovation, rather than being left behind by it.

Peripheral Device Integration

UP products offer versatile I/O configurations that integrate peripheral devices to unleash AI’s full potential. With the ability to incorporate hardware components like 3D cameras, light sensors, and MCUs, UP products channel the AI performance of the Hailo-8™ module. This gives you the potential to unlock a wide variety of functionality, from producing precise object detection models and harnessing the power of LiDAR to real-time navigation using ROS2.

A Titanium Member of the Intel® Internet of Things Solutions Alliance

The UP product line offers a wide array of solutions that are compatible with the Hailo-8™ M.2 2280 AI module, featuring an extensive range of onboard Intel® processors. From efficient Intel Atom®, Pentium®, and Celeron® platforms to exceptionally powerful 12th Gen Intel® Core™ Processors, available in form factors ranging from 85mm x 56mm to 120.35mm x 122.5mm, UP range caters to diverse vertical markets. It not only facilitates various projects but also serves as a strong foundation for advanced AI integration using the Hailo-8™ M.2 2280 AI module
UP Squared i12
UP Squared Pro 7000
UP Xtreme i12
UP Squared V2
UP 4000

The post UP – Comprehensive Platforms for Hailo-8™ M.2 2280 AI Module Integration first appeared on UP Bridge the Gap.

Move UP from NUC

✇UP Bridge the Gap
By: michelle
17 October 2023 at 19:07

While the Intel NUC may have come to an end, their legacy of compact, powerful Mini PCs lives on through AAEON’s UP Edge system range.

As the Intel NUC era comes to an end, it is crucial to reassess your requirements and find the perfect replacement. AAEON, a Titanium member of the Intel® Internet of Things Solutions Alliance, is here to guide you. Under AAEON's UP - Bridge the Gap brand, you'll discover a range of Mini PCs that embody the key characteristics that made the NUC so special: compact, fanless, and densely populated with high-speed interfaces, catering to a myriad of computing needs. With UP Edge Mini PCs, transitioning seamlessly from NUC to UP becomes a reality.

Boost computing performance with onboard Intel® Core™ i7-1260P or i5-1240P Processors alongside Intel® Iris® Xe graphics. Enjoy compatibility with Windows 10 Enterprise 2021 LTSC, Ubuntu 22.04, and Yocto 4.0. Expand your options with Wi-Fi 6, 5G, AI, and PCIe 4.0 storage support alongside 2.5GbE Ethernet with Time-Sensitive Networking (TSN).

The UP Squared Pro 7000 Edge boasts a low-profile, compact chassis with Intel® Processor N100 or Intel® Core™ i3-N305. Enjoy power-efficient operation with a versatile I/O, including three USB 3.2 and two COM ports, joined by three display outputs and dual 2.5GbE Ethernet. All with the added benefit of high-speed, low-power data transmission via LPDDR5.

The UP Squared V2 Edge, featuring the Intel® Celeron® Processor J6412, offers a cost-efficient alternative to entry-level NUC systems. It comes with Intel® UHD Graphics, onboard TPM 2.0, and supports Windows IOT Core, Windows 10, Ubuntu 20.04 LTS, and Yocto 3.1. Choose the UP Squared V2 Edge for maximum utility and value for your money.

A Titanium Member of the Intel® Internet of Things Solutions Alliance

As a Titanium member of the Intel® Internet of Things Solutions Alliance and multiple time Gold Member of the Intel Network Builders Winners’ Circle, AAEON’s track record of incorporating the newest and most advanced Intel technology is unparalleled.
30 years of ODM and Customization Experience

With over 30 years of experience in providing elite ODM and customization services, AAEON’s UP Team offers exceptional end-to end service, from initial concept to bringing the product to market.
Small Quantity, Large Projects, and Everything In Between

Whether a project requires a small number of pieces to fulfil a specific task or the mass production of large quantities of standard or customized solutions for more expansive applications, the UP Team has you covered.
24/7 Support from the UP Community

Home to more than 7,000 developers, the UP Community provides a space for collaboration, project sharing, and technical resources with which users are able to grow their business and receive 24/7 online support.

The post Move UP from NUC first appeared on UP Bridge the Gap.

UP 7000 – The Smaller, Faster, 3rd Generation Board

✇UP Bridge the Gap
By: michelle
10 October 2023 at 18:17

Breaking board-space records without breaking the bank
Product Page
 

Bridging the gap to the third generation of the acclaimed UP Board range, the UP 7000 surpasses expectation in every way. The world’s smallest developer board featuring the Intel® Processor N-series platform (formerly Alder Lake-N), the UP 7000 makes the jump to LPDDR5 system memory and Intel® UHD Graphics, along with onboard TPM 2.0 and support for both Windows and Linux operating systems. Combining these features with reliable, fanless operation enables users to seamlessly blend high-speed connectivity with superior graphics for use in applications such as digital signage, medical imaging, and AMR.
 
The World’s Smallest

Maintaining the 3.34” x 2.20” (85mm x 56mm) credit card-sized form factor of the original UP Board, along with its Raspberry Pi-compatible 40-pin HAT, the UP 7000 is the world’s smallest developer board featuring the new Intel® Processor N-series (formerly Alder Lake-N).
Onboard LPDDR5 System Memory

8GB of onboard LPDDR5 system memory provides exceptional data transmission speed for peripheral devices. Three USB 3.2 Gen 2 ports, GbE LAN, and a Raspberry Pi-compatible 40-pin HAT make the UP 7000 suitable for applications typically requiring boards with denser onboard interfaces, such as AMR.
 
Superior Vision with Intel® UHD Graphics

Substantially upgrading graphics performance, Intel® UHD Graphics offers an additional 6 execution units at 24 compared to its predecessor’s 18, along with higher execution speeds to aid deep learning. When paired with the board’s HDMI 1.4b interface, a higher number of execution units and greater frequency grant faster rendering and more FPS for applications such as digital signage.
AI,
Accelerated

Hosting CPUs with clock speeds up to 50% faster than those of its predecessors, along with Intel® AVX2 support for energy-efficient AI acceleration in such a miniature board; the UP 7000 is a low-power, high-performance solution for medical imaging and multifunction printing device applications.
Fanless, Versatile, Reliableanagement

Despite its small size, high-powered CPU platform, and LPDDR5 system memory, the UP 7000 has a fanless design, making it reliable in more deployment environments. Additionally, the board’s low power consumption to performance ratio makes it a more energy efficient solution, all without sacrificing quality.

To learn more about the UP 7000, please visit our product page.

The post UP 7000 – The Smaller, Faster, 3rd Generation Board first appeared on UP Bridge the Gap.

Alternative Solutions for Intel NUC Customers: Discover Our Industrial Edge Computing Boards and Systems

✇UP Bridge the Gap
By: Taylor Randolph
27 July 2023 at 15:50

Compact Computing on the Edge.

In light of the decision by Intel to discontinue support for their Intel NUC product line, we want to ensure you that UP Bridge the Gap has several trusted alternatives, tailored to meet the specific requirements of various industries.

UP xtreme i11 board, 3D Front view

UP Xtreme i11 Board

Intel® 11th Generation Core™ i3/i5/i7/Celeron
(formerly Tiger Lake)

UP Xtreme i12, 3D Front view

UP Xtreme i12 Board

Intel® 12th Generation Core™ i3/i5/i7/Celeron
(formerly Alder Lake-P)

UP Xtreme i12 Edge, system front view

UP Xtreme i11 Edge

Intel® 11th Generation Core™ i3/i5/i7/Celeron
(formerly Tiger Lake)

UP Squared Pro 7000, system 3D Front view

UP Squared Pro 7000 Edge

Intel® Atom® x7000E, Intel® Processor N series, Intel® Core™ i3-N305 (formerly Alder Lake-N)

Key Features

UP Edge Computing Boards and Systems are designed for the industrial market with several key features that make them stand out among the rest.

Compact, Rugged, Fanless Design

Designed to operate in space-constrained environments to ensure seamless integration into diverse setups. The fanless design eliminates concerns related to dust, debris, and noise, ensuring optimal performance in all conditions.

Longevity Support

A stable and enduring solution is critical for industrial projects, which is why UP Edge Computing Boards and Systems come with long-term longevity support to avoid frequent hardware replacements and ensure continuous operations.

Wide Temperature Operating Range

Capable of withstanding operating temperatures of up to 60° Celsius (140°F) to support solutions even in the harshest climates and conditions.


Explore UP Edge Computing Boards & Systems

Explore our comprehensive range of industrial edge computing boards and systems to discover the perfect fit for your solution. Our team of experts is ready to assist you in tailoring solutions that cater to specific industrial needs, and we are committed to providing unparalleled technical support throughout the transition.

The post Alternative Solutions for Intel NUC Customers: Discover Our Industrial Edge Computing Boards and Systems first appeared on UP Bridge the Gap.

The UP Squared i12 – The Smallest 12th Gen Intel Core-powered Developer Board

✇UP Bridge the Gap
By: michelle
14 July 2023 at 22:31

UP Squared i12
MIPI-CSI camera support and 12th Generation Intel® Core™ Processing on an 85.6mm × 90mm form factor add value, but not cost, to your project.
Product Page

As the UP Squared series’ third generation board, the UP Squared i12 introduces a wealth of new features to the 85.6mm × 90mm form factor. Most prominent of these is support for MIPI-CSI cameras and an expanded display interface, which are further augmented by CPU performance upgrades. The UP Squared i12 is also the smallest to be powered by 12th Generation Intel® Core™/Celeron® Processor 7000 Series Processors, which offers a substantial increase in performance and 8GB of onboard LPDDR5 system memory.

The UP Squared i12 is UP’s smallest board supporting a MIPI-CSI camera interface, maintaining the standard 85.6mm × 90mm UP Squared form factor while hosting two MIPI-CSI camera connectors via its carrier board. This gives developers access to more reliable and cost-efficient peripheral camera connections for applications across areas such as smart retail and machine vision.

The smallest board with 12th Gen Intel® Core™ processors, the UP Squared i12 greatly improves upon both the speed and efficiency of its predecessor due to its 4 performance and 8 efficient cores. The UP Squared i12 achieves quadruple its predecessor’s thread count due to Intel® Hyper-Threading Technology, alongside onboard LPDDR5 increasing data transmission speed by up to 50% for high-performance robotics solutions.

Supporting the UP Squared i12’s additional camera interface is its three simultaneous 4K displays, courtesy of a dual HDMI 1.4b/DP 1.2 stack connector and DP 1.4b via USB Type-C port. This configuration enables users to make the most of its M.2 2280 M-Key slot by integrating AI modules for enhanced inferencing, expanding the board’s application potential to healthcare imaging.

Smart Retail
Onboard LPDDR5 system memory facilitates fast edge data transmission for frictionless shopping, people-counting, and intelligent vending machine solutions.

Machine Vision
A small form factor and MIPI-CSI camera support allows for discreet, cost-efficient image collection, with edge-based analytic capability via AI expansion cards.

Healthcare Imaging
Multiple display interfaces channel exceptional inferencing via AI module support, enabling smart healthcare solutions such as ultrasounds.

Robotics
12th Gen Intel® Core™ processing, LPDDR5, and a wealth of peripheral device interfaces provide the foundation for elite robotics applications.

To learn more about the UP Squared i12, please visit our product page.

The post The UP Squared i12 – The Smallest 12th Gen Intel Core-powered Developer Board first appeared on UP Bridge the Gap.

Speeding UP Service with AI Edge Solutions

✇UP Bridge the Gap
By: michelle
27 June 2023 at 17:10

Speeding UP Service with AI Edge Solutions

Introduction

With the advances in AI Edge Computing technology, many vertical markets are eager to leverage this technology to improve their products and sales experience for their customers. We usually see various applications deployed in creating Smart Retail and Smart Signage solutions, helping to improve the shopping experience and providing more effective advertising. But how does this technology translate to the service industry, particularly fast-food restaurants?

One popular fast-food chain in New Zealand is rolling out an AI-powered system which combines several key AI technologies from different applications in order to power targeted marketing for their drive thru customers. By combining facial recognition technology to determine the age and gender of each driver along with identifying vehicle make and model, the system can first create a reference of which menu items are the most popular among certain demographics. The system then can use this data to suggest menu items to each driver via digital signage, providing a more tailored customer experience. It can also help track market trends and shifting tastes among different demographics.

A powerful concept needs a powerful hardware platform, so the fast-food chain reached out to AAEON to provide a solution which could power their project. AAEON analyzed their needs and offered the UP Xtreme with AI Core XM2280 module.

Challenges

Operating a Smart Drive Thru which combines digital signage with AI technology presents several unique challenges. AAEON worked closely with the fast-food chain to identify their key requirements and pain points. Knowing the challenges ahead, the UP Xtreme board with AI Core XM2280 module was chosen as the best option for this application.

Powerful Computing

With the range of technologies in place, the fast-food company needed a processor that could handle the many tasks required with the fastest speeds possible. The UP Xtreme board is powered by the 8th Generation Intel® Core™ U processors (formerly Whiskey Lake), delivering high performance processing on a small board. Additionally, the AI Core XM2280 delivers the AI acceleration needed to power the facial recognition technology, helping offload the tasks from the processor itself.

High Definition Graphics

To effectively deliver targeted marketing, the hardware solution needs to be capable of powering the high-quality graphics needed to entice customers to order suggested menu items. The UP Xtreme board features the Intel® Gen9 embedded graphics processor, allowing the board to power 4K HD outputs with its HDMI 2.0, DP1.2 and eDP connectors.

Low Delay Response

A fast-food drive-thru, as the name implies, requires fast service and ordering. In order to be effective, the hardware solution needs to perform analysis and display the appropriate targeted marketing within a very narrow window. Built for Edge Computing, the UP Xtreme handles all of these tasks right where they’re needed, reducing latency by not needed to connect to a remote cloud service.

UP Advantage

In addition to overcoming the challenges and meeting the needs of the project, the UP Xtreme board with AI Core XM2280 provided several key advantages, making it the perfect fit for the job. Alongside AAEON’s industry leading service, the UP Xtreme board with AI Core XM2280 provided rugged industrial design, compact form factor, and support for the Intel® distribution of OpenVINO™ toolkit.

Rugged Industrial Design

While New Zealand isn’t known for extreme temperatures, deploying a system outdoors, embedded in the drive-thru signage, still requires a board that can handle a wide range of temperatures and deliver consistent performance. The UP Xtreme can operate in temperatures from -20°C to 70°C, and utilizes components designed to withstand vibration and shock, as well as wide voltage input.

Compact Size

The UP Xtreme board is designed to easily integrate wherever it’s needed, from a broad I/O layout to easily connect with cameras and sensors, to a compact design that’s easy to fit into any tight space. This allows the fast-food chain to easily install the system into their signage without hassle.

OpenVINO™ Compatibility

The UP Xtreme board and AI Core XM2280 offer developers support and access to the Intel® distribution of OpenVINO™ toolkit. With the Intel Core processors and the two Intel® Movidius® Myriad™ X VPUs on the AI Core XM2280, it is easy to manage, program and optimize a wide range of AI inferences to deliver maximum performance on Intel based solutions.

Impact

Thanks to the powerful UP Xtreme board with AI Core XM2280 and AAEON’s industry leading service and support, the fast-food chain was able to bring their project from proof of concept to initialization and full deployment. AAEON worked closely with the chain to ensure everything ran smoothly, and integrated properly with their chosen cloud platforms. This provided an accelerated development time with faster time-to-market, allowing the chain to stay ahead of their competition.

With the system in place, the fast-food chain could start collecting the demographic data they needed, and now have the full AI-based Smart Drive Thru operational. With targeted marketing in place, it’s easier for the chain’s employees to upsell menu items, or even suggest new or limited time meals that may appeal to different diners. Additionally, the chain can capture even finer and more detailed purchasing data across a wide range of demographics.

For their customers, the drive thru experience is greatly enhanced in a way that’s almost imperceptible. Learning of new food items or even others they might have forgotten about, helps customers to experience a wider selection of the menu without feeling pressured by the drive-thru operator.

AAEON Solution

The UP Xtreme brings industrial grade features to the UP line of products, such as 12~60V wide voltage power input, two RS232/422/485 10-pin headers, and time sensitive networking (TSN) to facilitate communication in a connected factory. The UP Xtreme is also built to perform in temperatures ranging from 0°C up to 60°C.

The UP Xtreme offers flexible expandability with both a 40-pin and 100-pin connector, as well as m.2 2230 and 2280 slots, and mPCIe slots. The UP Xtreme can be expanded with wireless modules for Wi-Fi, Bluetooth, 4G and LTE. The UP Xtreme is compatible with other UP Board modules, including the AI Core X, AI Core XM 2280, and Vision Plus X, all featuring the Intel® Movidius™ Myriad™ X. With each module installed, the UP Xtreme supports up to six Intel® Movidius™ Myriad™ X modules, providing high-performance AI processing for edge computing applications.

The AI Core XM2280 m.2 module features two Intel® Movidius® Myriad™ X VPUS, a low-power high-performance accelerator designed for AI Edge Computing. The AI Core XM2280 delivers speeds up to 200 fps (160 typical) and over 2 trillion floating point operations as a dedicated neural network accelerator.

The UP Xtreme and AI Core XM2280 are both compatible with the Intel® distribution of OpenVINO™ Toolkit, providing a powerful software suite to help developers get their projects up and running quickly, with support for popular AI frameworks including TensorFlow and Caffe.

Thanks to AAEON’s Manufacturer Services, our clients can also enjoy full OEM/ODM support, from customizing existing boards, to providing full end-to-end service from design to testing to mass production. AAEON works closely with partners to help accelerate development and shorten time-to-market.

About UP Bridge the Gap

UP Bridge the Gap is a brand founded by AAEON Technology Europe in 2015. The UP team aims to bring innovation in technology, business models, and integrated solutions. The UP team collaborates with market leaders in different vertical markets to develop integrated solutions and build a large online community to work closely with developers.

About AAEON

Established in 1992, AAEON is one of the leading designers and manufacturers of industrial IoT and AI Edge solutions. With continual innovation as a core value, AAEON provides reliable, high-quality computing platforms including industrial motherboards and systems, rugged tablets, embedded AI Edge systems, uCPE network appliances, and LoRaWAN/WWAN solutions.

The post Speeding UP Service with AI Edge Solutions first appeared on UP Bridge the Gap.

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