Graperain G3562 is a Rockchip RK3562 quad-core Cortex-A53 system-on-module (SoM) with up to 8GB LPDDR4, up to 128GB eMMC flash suitable for Edge AI, IoT, automation, and consumer electronic applications. The company also provides the G3562 development board for the SoM with an M.2 socket for NVMe SSD, dual Ethernet, WiFi 5 and Bluetooth 5.0, and optional 4G LTE/3G cellular connectivity, plus a MIPI DSI/LVDS display connector, two MIPI CSI camera connectors, three USB 2.0 ports, audio interfaces, and expansion through a 30-pin GPIO header and UART connector. Graperain G3562 SoM GrapeRain G3562 specifications: SoC –  Rockchip RK3562 CPU – Quad-core Arm Cortex-A53 quad-core @ 2.0 GHz GPU – Mali-G52-2EE with support for OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, Vulkan 1.0/1.1 AI accelerator – 1 TOPS (INT8) NPU VPU Encoder – H.264 1920×1080 @ 60fps Decoder – H.265/VP9 4096×2304 @ 30fps; H.264 1920×1080 @ 60fps RAM – 2GB LPDDR4 by default [...]

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Variscite has introduced the DART-MX91 System on Module, a compact and cost-effective solution within the DART Pin2Pin family, targeting edge devices for IoT, smart cities, industrial applications, and more. Powered by a 1.4 GHz Cortex-A55 NXP i.MX 91 processor, the DART-MX91 supports up to 2GB of LPDDR4 memory and offers eMMC storage options ranging from […]

Forlinx FET-MX95xx-C is a system-on-module (SoM) based on NXP i.MX 95 SoC with up to six Cortex-A55 cores, an Arm Cortex-M7 real-time core clocked at 800 MHz, an Arm Cortex-M33 “safety” core clocked at 333 MHz, and equipped with 8GB LPDDR4x and 64GB eMMC flash. The company also provides the feature-rich OK-MX95xx-C development board based on the i.MX 95 module with a wide range of interfaces such as dual GbE, a 10GbE SFP+ cage, terminal blocks with RS485 and CAN Bus interface, three USB Type-A ports, two PCIe slots, and more. Forlinx FET-MX95xx-C system-on-module Specifications: SoC – NXP i.MX 9596 CPU 6x Arm Cortex-A55 application cores clocked at 1.8 GHz (industrial) with 32K I-cache and D-cache, 64KB L2 cache, and 512KB L3 cache Arm Cortex-M7 real-time core clocked at 800 MHz Arm Cortex-M33 safety core clocked at 333 MHz GPU – Arm Mali-G310 V2 GPU for 2D/3D acceleration with support [...]

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Day 4 of Giveaway Week 2024 will be for a development kit comprised of the Mixtile Core 3588E SoM based on Rockchip RK3588 octa-core Cortex-A76/A55 SoC and a Leetop A206 carrier board compatible with NVIDIA Jetson SO-DIMM modules. This development kit is mostly useful to evaluate the Mixtile Core 3588E system-on-module, but it can be used just like any Rockchip RK3588 SBC with the company providing a Ubuntu 22.04 Desktop image for the board. Since it relies on the same edge connector as the NVIDIA Jetson TX2 NX module, the Core 3588E module can also be connected to other compatible carrier boards. I reviewed the Mixtile Core 3588E development kit last December running Ubuntu 22.04. At the time, I found the Mixtile Core 3588E system-on-module performs well with the pre-loaded Ubuntu 22.04 image with a similar performance as on other Rockchip RK3588 hardware platforms. 3D graphics acceleration was working with [...]

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SiFive HiFive Premier P550 is a mini-DTX (203 x 170mm) motherboard powered by a 1.4 GHz ESWIN EIC7700X quad-core RISC-V SiFive P550 SoC with up to 19.95 TOPS of AI performance, and equipped with up to 32GB LPDDR5 memory and a 128GB eMMC flash all soldered on a system-on-module. The motherboard itself features a SATA III connector for data storage, includes an HDMI 2.0 port for 4K video output, a PCIe Gen3 x16 slot (working at x4), two gigabit Ethernet ports, an M.2 Key-E socket to add a WiFi/Bluetooth card, up to five USB interfaces, and more. HiFive Premier P550 specifications: SoC – ESWIN EIC7700X CPU 4x SiFive Performance P550 RV64GC RISC-V cores @ 1.4GHz (up to 1.8GHz when overclocked) with Cortex-A75-class performance 32KB(I) + 32KB(D) L1 Cache 256KB L2 Cache 4MB shared L3 Cache Cache supports ECC (support SECDED) NPU (Not currently supported in software) – Up to 19.95 [...]

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Firefly has released a Rockchip RK3576 SoM and development board called the Core-3576JD4 Core Board with a SO-DIMM edge connector and the AIO-3576JD4 carrier board respectively. The core board or the SoM is built around an octa-core 64-bit processor with a Mali G52 MC3 GPU and a 6 TOPS NPU, so it can handle demanding AI tasks while maintaining low power consumption. The AIO-3576JD4 is a full-fledged carrier board with a wide range of on-board interfaces, like dual Gigabit Ethernet ports, MIPI-CSI, HDMI 2.1, USB 3.0, USB 2.0, USB Type-C, a Phoenix connector for serial, dual-row pin headers (SPI, I2C, Line in, and Line out), an M.2 socket for 5G, a mini PCIe for 4G LTE, an M.2 socket for WiFi 6/BT 5.2, and a third M.2 socket for SATA/PCIe NVMe SSD expansion. RK3576 AI SoM and dev board specification Core-3576JD4 specifications SoC – Rockchip RK3576 CPU – Octa-core  CPU [...]

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Congatec has released a new line of Ryzen Embedded 8000-powered COM Express Type 6 Compact computer-on-modules with the conga-TCR8 module series offering up to 39 tera operations per second (TOPS) for AI inference and 128GB of DDR5-5600 memory with error correction code (ECC) for data-sensitive and data-critical applications. The Ryzen Embedded 8000 processor series comes with either six or eight ‘Zen 4’ cores, an integrated XDNA neural processing unit (16 TOPS), and the AMD Radeon RDNA 3 graphics unit which can be used as a general-purpose graphics processing unit with up to 12 compute units (adding up to 39 TOPS for the SoC). Graphics output is supported by four displays with up to 8K resolution, and peripheral options include six PCIe Gen 4 slots, four USB 3.2 Gen 2 ports, four USB 2.0 ports, and three DisplayPort interfaces. The conga-TCR8 Type 6 modules are intended for high-volume applications that require [...]

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MYiR Tech’s MYC-LD25X is a compact 39x37mm system-on-module built around the STMicro STM32MP25 dual-core Cortex-A35 SoC running at 1.5GHz with a Cortex-M33 core, and an NPU capable of 1.35 TOPS. The module comes with up to 2GB LPDDR4 RAM, 8GB eMMC storage, and a range of connectivity options, including Gigabit Ethernet, USB, CAN FD, UART, and SPI. Designed for industrial HMI, edge computing, energy systems, and automation, the MYC-LD25X is suitable for high-performance applications in these fields. Previously, we covered other development boards from MYiR, including the MYD-J7A100T, MYD-YG2UL, MYD-YG2LX, and MYD-J1028X. We also wrote about other STM32MP25-based system-in-package and system-on-module namely the Digi ConnectCore MP25 and Octavo OSD32MP2. Feel free to check them out if you’re interested. MYC-LD25X STM32MP25-based System-On-Module MYC-LD25X specifications: SoC – STMicro STM32MP257D processor CPU – Dual-core Arm Cortex-A35 64-bit RISC core operating at up to 1.5 GHz MPU – 32-bit Arm Cortex-M33 RISC core clocked at [...]

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The Turing Pi 2.5 is a mini-ITX motherboard designed for clusters of system-on-modules such as Raspberry Pi CM4, NVIDIA Jetson modules, or the company’s own RK1 SoM powered by a Rockchip RK3588 AI SoC. A mini-ITX case compatible with both the Turing Pi 2 and 2.5 boards is also available. The Turing Pi 2.5 is an upgrade to the earlier Turing Pi 2 with the main key features, but some updates related to USB, HDMI output, new 8-pin connectors for I2C, audio, and GPIO pins, and BMC upgrades. While the company has just announced the start of Turing Pi 2.5 and the mini-ITX case pre-order, documentation and photos on the store and documentation website have not been updated. Everything is still about the Turing Pi 2 except for the information in the announcement. I won’t go through the specs since they are not available for the latest version, but the [...]

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