In 2022, we covered Intel’s Xeon D (Ice Lake-D) processor family, which includes the D-2700 and D-1700 models. These processors are designed for software-defined networking and edge applications, providing data center-grade capabilities at the edge. Key features include integrated AI and crypto acceleration, built-in Ethernet, and support for Intel Time Coordinated Computing (TCC) and Time-Sensitive Networking (TSN) to ensure high reliability. Leveraging these advanced capabilities, companies like ADLINK Technology and Congatec have introduced COM-HPC server modules and COM Express Type 7 modules based on the new Xeon D lineup. Axiomtek’s CEM710 is a COM Express Type 7 Basic Module powered by Intel Xeon D-1700 Series processors, designed for edge computing, industrial automation, and data-intensive applications. It offers up to 10 cores, 100Gbps Ethernet, and 64GB of DDR4 ECC memory, along with PCIe Gen3 slots for expandability. With rugged features and TPM 2.0 for security, it ensures reliable performance in demanding [...]

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Congatec has released a new line of Ryzen Embedded 8000-powered COM Express Type 6 Compact computer-on-modules with the conga-TCR8 module series offering up to 39 tera operations per second (TOPS) for AI inference and 128GB of DDR5-5600 memory with error correction code (ECC) for data-sensitive and data-critical applications. The Ryzen Embedded 8000 processor series comes with either six or eight ‘Zen 4’ cores, an integrated XDNA neural processing unit (16 TOPS), and the AMD Radeon RDNA 3 graphics unit which can be used as a general-purpose graphics processing unit with up to 12 compute units (adding up to 39 TOPS for the SoC). Graphics output is supported by four displays with up to 8K resolution, and peripheral options include six PCIe Gen 4 slots, four USB 3.2 Gen 2 ports, four USB 2.0 ports, and three DisplayPort interfaces. The conga-TCR8 Type 6 modules are intended for high-volume applications that require [...]

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