AMD Versal Premium Series Gen 2 SoC FPGA combines dual-core Cortex-A72 and dual-core Cortex-R5F processors with high-end FPGA fabric with up to 3.2 million logic cells and CXL 3.1 (Compute Express Link), PCIe Gen6, and DDR5/LPDDR5X high-bandwidth interfaces for data center, communication equipment, test & measurement, and aerospace & defense data-intensive applications. AMD Versal Premium Gen2 specifications: CPU cores Dual-core Arm Cortex-A72 application core, 48 KB/32 KB L1 Cache w/ parity & ECC; 1 MB L2 Cache w/ ECC Dual-core Arm Cortex R5F, 32 KB/32 KB L1 Cache, and 256 KB TCM w/ECC Memory – 256MB on-chip with ECC FPGA fabric System Logic Cells – Up to 3,273,480 LUTs – Up to 1,496,448 DSP Engines – Up to 7,616 Interfaces connected to CPU cores 2x Ethernet 2x UART, 2x SPI, 2x I2C 2x CAN-FD 1x USB 2.0 FPGA memory, interfaces, I/Os, and transceivers Up to 327 Mbit memory @ 273 [...]

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In 2022, we covered Intel’s Xeon D (Ice Lake-D) processor family, which includes the D-2700 and D-1700 models. These processors are designed for software-defined networking and edge applications, providing data center-grade capabilities at the edge. Key features include integrated AI and crypto acceleration, built-in Ethernet, and support for Intel Time Coordinated Computing (TCC) and Time-Sensitive Networking (TSN) to ensure high reliability. Leveraging these advanced capabilities, companies like ADLINK Technology and Congatec have introduced COM-HPC server modules and COM Express Type 7 modules based on the new Xeon D lineup. Axiomtek’s CEM710 is a COM Express Type 7 Basic Module powered by Intel Xeon D-1700 Series processors, designed for edge computing, industrial automation, and data-intensive applications. It offers up to 10 cores, 100Gbps Ethernet, and 64GB of DDR4 ECC memory, along with PCIe Gen3 slots for expandability. With rugged features and TPM 2.0 for security, it ensures reliable performance in demanding [...]

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