In 2022, we covered Intel’s Xeon D (Ice Lake-D) processor family, which includes the D-2700 and D-1700 models. These processors are designed for software-defined networking and edge applications, providing data center-grade capabilities at the edge. Key features include integrated AI and crypto acceleration, built-in Ethernet, and support for Intel Time Coordinated Computing (TCC) and Time-Sensitive Networking (TSN) to ensure high reliability. Leveraging these advanced capabilities, companies like ADLINK Technology and Congatec have introduced COM-HPC server modules and COM Express Type 7 modules based on the new Xeon D lineup. Axiomtek’s CEM710 is a COM Express Type 7 Basic Module powered by Intel Xeon D-1700 Series processors, designed for edge computing, industrial automation, and data-intensive applications. It offers up to 10 cores, 100Gbps Ethernet, and 64GB of DDR4 ECC memory, along with PCIe Gen3 slots for expandability. With rugged features and TPM 2.0 for security, it ensures reliable performance in demanding [...]

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The Trenz Electronic AXE5-EAGLE-ES devkit (development kit) is powered by an Intel Agilex 5 E-series SoC FPGA, codenamed Sundance Mesa. It is designed for FPGA applications in sectors such as wireless communication, video broadcast, and defense. The kit provides 656k logic elements and a quad-core processing system featuring dual-core Arm Cortex-A76 and Cortex-A55 clusters. It supports high-speed transceivers up to 17 Gbps, PCIe 4.0 connectivity, and integrated memory interfaces like DDR4 and LPDDR4/5. Built on Intel’s 7 technology, the Agilex 5 architecture is optimized for midrange FPGA applications, offering a compact design with efficient performance-per-watt. The FPGA includes enhanced DSP blocks with AI Tensor capabilities for AI and digital signal processing tasks. Additionally, it incorporates Intel’s second-generation Hyperflex Architecture, enabling greater flexibility for handling dynamic workloads. Previously, we covered the iW-RainboW-G58M system-on-module, which features Intel’s Agilex 5 SoC FPGA E-series, a cost-effective, midrange solution for intelligent edge and embedded applications. [...]

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Jetway JPIC-ADN1 is a fanless pico-ITX SBC powered by an Intel N97 or N200 Alder Lake-N processor and targeted at industrial robotics applications. The JPIC-ADN1 supports up to 32GB of memory via a single-channel SO-DIMM slot. The SoC comes with UHD Graphics, supporting dual-display outputs via HDMI 2.0b and a 24-bit dual-channel LVDS interface. For storage, it features an M.2 B+M-Key socket and a SATA 3 port, plus an E-Key 2230 socket for wireless expansion. Gigabit Ethernet networking is handled by the RTL8111H GbE controller. Additionally, it has a serial header, 8-bit GPIO, SMBUS, watchdog timer, and much more. JPIC-ADN1 fanless SBC specification Alder Lake-N SoC (one or the other) Intel Processor N97 quad-core Alder Lake N-series processor with Intel UHD graphics; 12W TDP Intel Processor N200 quad-core processor @ up to 3.7 GHz (Turbo) with 6MB cache, 32EU Intel HD graphics @ up to 750 MHz; TDP: 6W Additional compatible CPUs available via regional sales [...]

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Altera, an independent subsidiary of Intel, has launched the Altera Agilex 3 SoC FPGA lineup built on Intel’s 7nm technology. According to Altera, these FPGAs prioritize cost and power efficiency while maintaining essential performance. Key features include an integrated dual-core Arm Cortex A55 processor, AI capabilities within the FPGA fabric (tensor blocks and AI-optimized DSP sections), enhanced security, 25K–135K logic elements, 12.5 Gbps transceivers, LPDDR4 support, and a 38% lower power consumption versus competing FPGAs. Built on the Hyperflex architecture, it offers nearly double the performance compared to previous-generation Cyclone V FPGAs. These features make this device useful for manufacturing, surveillance, medical, test and measurement, and edge computing applications. Altera’s Agilex 3 AI SoC FPGA specifications Device Variants B-Series – No definite information is available C-Series – A3C025, A3C050, A3C065, A3C100, A3C135 SoC FPGAs Hard Processing System (HPS) – Dual-core 64-bit Arm Cortex-A55 up to 800 MHz that supports secure [...]

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Seeed Studio’s reServer Industrial J501, a Jetson AGX Orin carrier board designed for building Edge AI systems. With up to 275 TOPS of exceptional AI performance, this carrier board is designed for advanced robotics and edge AI applications for industrial environments. The carrier board features GbE and 10GbE LAN via RJ45 ports, three USB 3.1 ports, an HDMI 2.1 output, and multiple M.2 slots for expansion, including support for wireless connectivity via the M.2 Key B socket. Additionally, it has support for 8K video decoding and up to 8 GMSL cameras via an optional extension board. reServer Industrial J501 Jetson AGX Orin carrier board specification System-on-Module (one or the other) SoM –  NVIDIA Jetson AGX Orin 64GB with CPU – 12-core Arm Cortex-A78AE v8.2 64-bit processor with 3MB L2 + 6MB L3 cache GPU / AI accelerators NVIDIA Ampere architecture with 2048 NVIDIA CUDA cores and 64 Tensor Cores @ [...]

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