Many PCB vendors now provide flexible PCB manufacturing services, but Murata goes further with stretchable PCB technology that’s not only bendable but can be twisted and stretched to better fit on the body for bio-sensing and medical applications even on parts such as an elbow. Traditional bio-monitoring sensors have some limitations. For example, they can become unstuck when the body moves, damage the delicate skin of infants and the elderly, data may be distorted due to body movement, and Murata explains “there is a risk of a decline in insulation and the occurrence of ion migration when using a thermoplastic polyurethane elastomer (TPU), known as a stretchable base material, in a high humidity environment”. The company’s stretchable printed circuits ((SPC) are supposed to solve or at least mitigate all those issues. The technology is under development, but Murata still shared some highlights of the technology: Stretchable electrode printing in compliance [...]

The post Murata unveils stretchable PCB technology for medical and bio-sensing applications appeared first on CNX Software - Embedded Systems News.

STMicroelectronics (STMicro) has announced the ST1VAFE3BX biosensor, a highly integrated chip that combines “cardio and neurological sensing with motion tracking and embedded AI functionalities,” and is targeted at healthcare and fitness wearables. The ST1VAFE3BX biosensor chip integrates biopotential inputs with an accelerometer and a machine learning core for reduced power consumption. It features a complete vertical analog front end (vAFE) for simplified detection of vital signs in electrocardiography, electroencephalography, and other healthcare monitoring applications. Inertial sensing by the accelerometer is synchronized with biopotential sensing “to infer any link between measured signals and physical activity.” The integrated machine-learning core (MLC) and finite state machine (FSM) allow for ultra-low-power and accurate biopotential input recognition at a degree of responsiveness that is reportedly faster than the current industry standard. The ST1VAFE3BX is aimed at applications in healthcare and fitness wearables such as smartwatches, smart patches, sports bands, connected rings, and smart glasses. It [...]

The post STMicro’s low-power ST1VAFE3BX AI biosensor integrates biopotential signal monitoring and motion tracking appeared first on CNX Software - Embedded Systems News.

Microchip recently unveiled the PIC64HX1000 64-bit RISC-V AI microprocessor (MPU) family designed for mission-critical intelligent edge applications in the aerospace, defense, industrial, and medical sectors thanks to a quantum-resistant design. These new MPUs feature eight SiFive’s Intelligence X280 cores, each clocked at 1 GHz. The MPUs are engineered with a decoupled vector pipeline enabling 512-bit operations enabling the PIC64HX1000 to achieve up to 2 TOPS for AI/ML processing and come equipped with integrated Time-Sensitive Networking (TSN) Ethernet connectivity. This new microprocessor includes a dedicated system controller for runtime monitoring and fault management, WorldGuard architecture for workload isolation, and post-quantum defense-grade cryptography, which includes the NIST-standardized FIPS 203 and FIPS 204 cryptographic algorithms, ensuring protection against future quantum computing threats. PIC64HX1000 64-bit AI MPU specification MPU variants PIC64HX1000 – IN (Industrial) PIC64HX1000 – AV (Aviation) PIC64HX1000 – MI (Military) CPU – 8x 64-bit RISC-V cores (SiFive X280), up to 1 GHz, [...]

The post Microchip PIC64HX1000 64-bit RISC-V AI MPU delivers post-quantum security for aerospace, defense, and automotive applications appeared first on CNX Software - Embedded Systems News.

Japanese company KAGA FEI has recently unveiled the incredibly small ES5L15BA1 Bluetooth LE 6.0 and 802.15.4 module based on Nordic Semi nRF54L15 ultra-low-power Cortex-M33 wireless MCU. We had previously covered the u-Blox NORA-B2 which I already found pretty small at 14.3 x 10.4 x 1.9mm, but the ES5L15BA1 module goes a step further measuring just 8.55 x 3.25 x 1.00 mm with an integrated antenna which could make it the world’s smallest Bluetooth LE module. KAGA FEI ES4L15BA1 specifications: SoC – Nordic Semiconductor nRF54L15 MCU cores Arm Cortex-M33 with Arm TrustZone @ 128MHz RISC-V coprocessor for software-defined peripheral Memory – 256KB SRAM Storage – 1.5MB non-volatile memory Wireless Bluetooth 6.0 Data rates – 2Mbps, 1Mbps, 500kbps, 125kbps Features AoA / AoD Channel Sounding 802.15.4 radio for Thread / Zigbee / Matter Nordic Proprietary 2.4 GHz protocol up to 4 Mbps Frequency – 2402 to 2480 MHz +8dBm output power Antenna [...]

The post KAGA FEI ES4L15BA1 is an ultra-small Bluetooth LE 6.0 and 802.15.4 module based on Nordic nRF54L15 SoC appeared first on CNX Software - Embedded Systems News.

Altera, an independent subsidiary of Intel, has launched the Altera Agilex 3 SoC FPGA lineup built on Intel’s 7nm technology. According to Altera, these FPGAs prioritize cost and power efficiency while maintaining essential performance. Key features include an integrated dual-core Arm Cortex A55 processor, AI capabilities within the FPGA fabric (tensor blocks and AI-optimized DSP sections), enhanced security, 25K–135K logic elements, 12.5 Gbps transceivers, LPDDR4 support, and a 38% lower power consumption versus competing FPGAs. Built on the Hyperflex architecture, it offers nearly double the performance compared to previous-generation Cyclone V FPGAs. These features make this device useful for manufacturing, surveillance, medical, test and measurement, and edge computing applications. Altera’s Agilex 3 AI SoC FPGA specifications Device Variants B-Series – No definite information is available C-Series – A3C025, A3C050, A3C065, A3C100, A3C135 SoC FPGAs Hard Processing System (HPS) – Dual-core 64-bit Arm Cortex-A55 up to 800 MHz that supports secure [...]

The post Altera’s 7nm Agilex 3 SoC FPGA features Cortex-A55 cores, AI Tensor Block, DSP, 10 GbE, and more. appeared first on CNX Software - Embedded Systems News.