Wouldn’t it be great if, while playing a virtual reality game, you could feel the heat of a fire on your arm? Or the cold of chilly water? Engineers around the world have been trying to make that happen, but there is a big problem: temperature changes are slow. The immersive effect diminishes when the thermal feedback lags behind the virtual cause. That’s why a team from South Korea’s Gwangju Institute of Science and Technology turned to motors to dramatically speed up the process.

The Flip-Pelt wearable device relies on Peltier elements to create heating and cooling effects, which is a common strategy for thermal feedback. Peltier elements use electricity to produce thermal transfer, heating one side of the element while simultaneously cooling the other side. By placing a Peltier element against the skin, it is possible to create a cooling or heating sensation on demand.

But it takes a long time to reverse the thermal transfer — changing a side of the Peltier element from hot to cold is too slow to be useful for VR thermal feedback. So, the Flip-Pelt prototype doesn’t even bother. Instead, it keeps the Peltier elements going in just one direction and physically swaps the side of the elements that touch the user’s skin.

The prototype Flip-Pelt device contains eight Peltier elements arranged in two rows along the inside of the user’s forearm. Eight servo motors, controlled by an Arduino Nano 33 IoT board, can flip the elements from the cool side to the hot side in response to events in the VR world. The Arduino also controls the Peltier elements themselves through H-bridges, so it can adjust the power going to each.

While this is relatively complex, it does create almost instant changes in perceived temperature.

You can read more about the project in the team’s published paper here.

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STMicroelectronics (STMicro) has announced the ST1VAFE3BX biosensor, a highly integrated chip that combines “cardio and neurological sensing with motion tracking and embedded AI functionalities,” and is targeted at healthcare and fitness wearables. The ST1VAFE3BX biosensor chip integrates biopotential inputs with an accelerometer and a machine learning core for reduced power consumption. It features a complete vertical analog front end (vAFE) for simplified detection of vital signs in electrocardiography, electroencephalography, and other healthcare monitoring applications. Inertial sensing by the accelerometer is synchronized with biopotential sensing “to infer any link between measured signals and physical activity.” The integrated machine-learning core (MLC) and finite state machine (FSM) allow for ultra-low-power and accurate biopotential input recognition at a degree of responsiveness that is reportedly faster than the current industry standard. The ST1VAFE3BX is aimed at applications in healthcare and fitness wearables such as smartwatches, smart patches, sports bands, connected rings, and smart glasses. It [...]

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Engineer and YouTuber Carl Bugeja recently developed CodeCell, a tiny ESP32-C3 development board designed as the brain for robots, wearables, and smart home devices. This module features a nine-axis inertial measurement unit (IMU) for motion fusion and an optional VCNL4040 light sensor. It includes a USB Type-C port for data and power as well as a lithium-polymer battery with a charging circuit. Measuring just 18.5 x 18.5mm this compact board is even smaller than other tiny ESP32 development boards such as Waveshare’s ESP32-S3-Zero and Seeed Studio’s XIAO ESP32S3. However, the Epi C3 is smaller at 23 x 12.75 mm, and so are the Unexpected Maker NANOS3 (25 x 10 mm) and Unexpected Maker OMGS3 (28 x 11 mm). CodeCel ESP32-C3 mini development board specification Microcontroller – ESP32-C3 RISC-V MCU 160MHz 32-bit RISC-V processor core 400kB SRAM, 4MB flash storage Wi-Fi 4 and Bluetooth Low Energy (BLE) connectivity Sensors Vishay VCNL4040 light [...]

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Spectra is a JavaScript-based hackable smartwatch based on the ESP32-S3 WiFi and Bluetooth microcontroller that aims to offer the quality of high-end consumer smartwatches with the repairability of a maker-targeted device. The Spectra smartwatch combines the ESP32-S3 microcontroller with a Nordic Semi nRF52832 co-processor to optimize the battery life. The ESP32-S3 is maxed out with 8MB of RAM and 32MB of external flash memory, and the microSD card slot in the watch supports up to a 512GB memory card. It shares a similar concept with the Bangle.js and the Bangle.js 2 customizable smartwatches. According to the maker, Spectra is not bound to be fully open-source, since the project uses “external proprietary code [they] aren’t allowed to share.” They plan to publish Arduino libraries and hardware design files, but there is no live GitHub repository yet. Other hackable smartwatches include the TinyWatch S3, the ZSWatch, and the Sensor Watch Pro. Spectra [...]

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Japanese company KAGA FEI has recently unveiled the incredibly small ES5L15BA1 Bluetooth LE 6.0 and 802.15.4 module based on Nordic Semi nRF54L15 ultra-low-power Cortex-M33 wireless MCU. We had previously covered the u-Blox NORA-B2 which I already found pretty small at 14.3 x 10.4 x 1.9mm, but the ES5L15BA1 module goes a step further measuring just 8.55 x 3.25 x 1.00 mm with an integrated antenna which could make it the world’s smallest Bluetooth LE module. KAGA FEI ES4L15BA1 specifications: SoC – Nordic Semiconductor nRF54L15 MCU cores Arm Cortex-M33 with Arm TrustZone @ 128MHz RISC-V coprocessor for software-defined peripheral Memory – 256KB SRAM Storage – 1.5MB non-volatile memory Wireless Bluetooth 6.0 Data rates – 2Mbps, 1Mbps, 500kbps, 125kbps Features AoA / AoD Channel Sounding 802.15.4 radio for Thread / Zigbee / Matter Nordic Proprietary 2.4 GHz protocol up to 4 Mbps Frequency – 2402 to 2480 MHz +8dBm output power Antenna [...]

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IoT solutions company Raytac has introduced the AN7002Q Wi-Fi 6 module series, which integrates Nordic Semiconductor’s nRF7002 chipset and is designed for Industrial IoT, smart home, healthcare, consumer electronics, and automotive applications. They can be paired with Raytac’s MDBT53 Bluetooth LE modules based on the nRF5340 multiprotocol SoC, supporting Wi-Fi and Bluetooth LE solutions. The AN7002Q is a low-power Wi-Fi 6 module supporting dual-band 2.4 GHz and 5 GHz operation with a maximum PHY data rate of 86 Mbps (MCS7). It is compatible with IEEE 802.11ax, a/b/g/n/ac standards, and connects to a host SoC or MCU via SPI or QSPI interfaces. The module also supports coexistence with Bluetooth LE, Thread, and Zigbee systems, making it ideal for IoT applications. Previously, we covered the Abluetech PTR7002, a low-power wireless module based on the Nordic Semiconductor nRF7002. The PTR7002 has a slightly larger size and offers more GPIO options, while the AN7002Q [...]

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NXP has recently announced the release of  NXP i.MX RT700 RT700 AI crossover MCU following the NXP i.MX RT600 series release in 2018 and the i.MX RT500 series introduction in 2021. The new i.MX RT700 Crossover MCU features two Cortex-M33 cores, a main core clocked at 325 MHz with a Tensilica HiFi 4 DSP and a secondary 250 MHz core with a low-power Tensilica HiFi 1 DSP for always-on sensing tasks. Additionally, it integrates a powerful eIQ Neutron NPU with an upgraded 7.5 MB of SRAM and a 2D GPU with a JPEG/PNG decoder. These features make this device suitable for applications including AR glasses, hearables, smartwatches, wristbands, and more. NXP i.MX RT700 specifications: Compute subsystems Main Compute Subsystem Cortex-M33 @ up to 325 MHz with Arm TrustZone, built-in Memory Protection Unit (MPU), a floating-point unit (FPU),  a HiFi 4 DSP and supported by NVIC for interrupt handling and SWD [...]

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