RED-BEET 2.0: Advanced Powerline Communication for E-Mobility Applications

Qualcomm has added two new IoT modules to its wireless connectivity product series: the Qualcomm QCC730M ‘micro-power’ WiFi 4 module and the QCC74xM tri-radio module, with both modules designed for smart homes, smart appliances, medical devices, and industrial applications. The Qualcomm QCC730M is a dual-band, micro-power Wi-Fi 4 module with a 60MHz Arm Cortex-M4F MCU, 640kB SRAM, 1.5MB RRAM, hardware crypto accelerator, and secure boot, debug, and storage. Its low-power design is ideal for portable, battery-powered IoT devices like IP cameras, sensors, and smart locks. Based on the Qualcomm QCC730 module, it features a 36-pin LGA package with a PCB antenna or RF connector and supports up to 4MB of optional NOR flash. The Qualcomm QCC74xM is Qualcomm’s “first programmable connectivity module,” integrating a 32-bit RISC-V module, optional stacked memory (PSRAM and NOR flash), and a tri-radio chipset for WiFi 6, Bluetooth 5.3, and IEEE 802.15.4 (Thread and Zigbee). Its [...]

The post Qualcomm QCC730M dual-band WiFi 4 and QCC74xM WiFi 6, BLE 5.3, and 802.15.4 modules target low-power and IoT edge devices appeared first on CNX Software - Embedded Systems News.

Qualcomm Technologies has introduced the new industrial-grade IQ chipset family with the IQ9, IQ8, and IQ6 series offering on-device AI performance of up to 100 TOPS, industrial temperature range, and built-in safety features such as SIL-3 (safety and integrity level). Qualcomm IQ series of chipsets target a range of premium (IQ9), mid-tier (IQ8), and entry-level (IQ6) applications such as industrial and agricultural robots, drones, industrial inspection and automation, edge AI boxes with computer vision capabilities, edge gateway analytics solutions, and more. Qualcomm IQ9 Series – IQ-9100, IQ-9075 Key features and specifications: CPU IQ-9075 – Octa-core Kryo Gen 6 scaling from 1.632 to 2.55 GHz IQ-9100 – Octa-core Kryo Gold Prime @ 2.36 GHz (CNXSoft: The specs are not clear for the CPU part…, both SKUs could be the same for the CPU part) GPU – Adreno 663 GPU Audio DSP (LPASS) 1980 MPPS, 7x TDM/I2S 3x High-Speed I2S for Radio [...]

The post Qualcomm introduces IQ9, IQ8, and IQ6 industrial IoT SoC families with up to 100 TOPS of AI performance appeared first on CNX Software - Embedded Systems News.

The Qualcomm Networking Pro A7 Elite platform is a new wireless networking platform that integrates WiFi 7 with edge AI. The wireless networking platform can deliver up to 33 Gbps of throughput and features an AI coprocessor that provides up to 40 TOPS for AI workloads. AI features are designed to enhance Wi-Fi and networking user experience and include Smart Traffic Classifier, Range Boost, and Networking AIOps. The platform also includes 10Gbps Fiber (XGS-PON), Ethernet, front-end modules, and filters into an integrated platform. All these features are designed to streamline system development and reduce design complexity by integrating key elements—from broadband to antenna—into an integrated platform. Qualcomm Networking Pro A7 Elite platform specification Qualcomm’s Wireless Networking Platform CPU – Unnamed quad-core processor, built on a 14 nm node, and clocked at 1.8 GHz NPU – Up to 40 TOPS (AI coprocessor featuring Qualcomm Hexagon NPU) System Memory – DDR3L/DDR4 Storage [...]

The post Qualcomm Networking Pro A7 Elite is a WiFi 7 SoC with a 40 TOPS NPU for AI-optimized traffic and range appeared first on CNX Software - Embedded Systems News.

Today, Thundercomm introduced RUBIK Pi at an industry event in Austin, Texas. This development board, built on Qualcomm SoC platforms, is the first Pi product to offer AI capabilities tailored for high-performance application development. Featuring the Qualcomm QCS6490 processor, RUBIK Pi provides 12.5 TOPS of AI inference power, enabling efficient AI and machine learning workflows […]