The HL7900 5G LPWA module from Semtech (Sierra Wireless) is a globally certified solution built around Sony’s Altair ALT1350 chip and designed for low-power IoT applications. It is certified by major U.S. carriers, including AT&T, T-Mobile, and Verizon, as well as Japan’s KDDI, and has achieved global regulatory certifications (FCC, CE, ISED, etc.) and industry certifications (PTCRB, GCF) for carrier interoperability. This chip features an ultra-low-power sensor hub MCU for efficient environmental monitoring. Additionally, it includes integrated sub-GHz and 2.4GHz radios supporting short-range protocols such as Wi-SUN including U-Bus Air, NB-IoT, and 5G NTN along with GNSS and Wi-Fi-based indoor/outdoor tracking. Furthermore, this chip supports embedded SIM support, secure edge-to-cloud connectivity, and over-the-air updates. These features make this chip useful for applications such as asset tracking, urban navigation, and other IoT solutions requiring reliable, low-power connectivity with global reach. Semtech HL7900 specifications: MCU – Sony ALT1350 5G cellular IoT chip [...]

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Infineon recently launched the PSOC Control C3x family of Arm Cortex-M33 MCUs for real-time control applications in motor control and power conversion systems. The family includes 18 MCUs categorized into two lines, the Entry Line (C3P2, C3M3) and the Main Line (C3P5, C3M5). These MCUs can be used for various applications including home appliances, industrial drives, robots, light electric vehicles (LEVs), solar systems, and HVAC systems. The Entry Line operates at up to 100 MHz and supports a 12-bit SAR ADC with a sampling rate of up to 6 Msps, making it suitable for basic motor control and power conversion tasks. In contrast, the Main Line offers higher performance with up to 180 MHz operation, a faster 12-bit SAR ADC up to 12 Msps, and 4-channel High-Resolution PWM (HRPWM) for precise control. It also supports Wide Bandgap (WBG) switches for high-frequency power systems. Other features of this MCU include DSPs, FPUs, [...]

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NXP recently launched the EdgeLock A30 Secure Authenticator chip, a Common Criteria EAL 6+ certified secure authentication designed for IoT devices, including battery authentication applications. It complies with the EU’s Batteries Regulation 2023/1542, which mandates the inclusion of a Digital Product Passport (DPP), by 2027 to ensure traceability, sustainability, and safety in battery manufacturing and recycling. Alasdair Ross, Senior Director, NFC IoT Security, NXP explains: Secure authentication helps to ensure brand protection, consumer safety, and product traceability, fostering trust and shielding devices from physical damage. Smaller than a grain of rice, the EdgeLock A30 is designed to fit into even the smallest of devices. It supports multiple authentication use cases, making it easier for developers to support a variety of devices and accessories with a single solution, including device to device, cloud to device, counterfeit protection, and storage or protection of device identity. To address these requirements NXP’s EdgeLock A30 [...]

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Designed by Boltz R&D, the SmartPrintCoreH7x 3D printer mainboard is an open-source mainboard built around an STM32H7 microcontroller and designed to work with 3D printers from Creality, Anet, and Voron. It supports up to 6 stepper drivers (5 standard drivers plus 1 dedicated driver) and can be expanded further using the “SmartPrintCore Extravaganza” module for additional stepper drivers. Key features of this motherboard include a jumper-less setup, automatic power source switching, and support for both 12V and 24V power supplies. It uses high-efficiency TI buck converters to provide power for multiple fan and servo ports, and there is a dedicated power supply for peripherals, SBCs, and Wi-Fi modules. The board is equipped with a variety of connectors, including Molex, Ultra-Fit, Mini-Lock, and JST-GH for power, motors, and peripherals. SmartPrintCoreH7x specifications: MCU – STMicro STM32H723 Arm Cortex-M7 32-bit core @ 550 MHz with 1MB Flash, 564 KB RAM, FPU, DSP, Ethernet, USB [...]

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While looking for new and interesting products I found ADLINK’s DLAP Supreme series, a series of Edge AI devices built around the NVIDIA Jetson AGX Orin platform. But that was not the interesting part, what got my attention was it has support for something called the aiDAPTIV+ technology which made us curious. Upon looking we found that the aiDAPTIV+ AI solution is a hybrid (software and hardware) solution that uses readily available low-cost NAND flash storage to enhance the capabilities of GPUs to streamline and scale large-language model (LLM) training for small and medium-sized businesses. This design allows organizations to train their data models on standard, off-the-shelf hardware, overcoming limitations with more complex models like Llama-2 7B. The solution supports up to 70B model parameters with low latency and high-endurance storage (100 DWPD) using SLC NAND. It is designed to easily integrate with existing AI applications without requiring hardware changes, [...]

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BCM Advanced Research has recently introduced two new fanless open-frame panel PCs powered by an Intel Processor N50 CPU – the OFT07W-ADLN (7-inch) and OFT10W-ADLN (10-inch) – which are low-cost all-in-one embedded computers designed for tablet-like usability. Both modules feature 8GB LPDDR5 memory, 64GB eMMC storage, and an M.2 E-key slot for Wi-Fi/Bluetooth connectivity. These panel PCs come with PCAP touchscreens (800×1280 for 7-inch and 1200×1920 for 10-inch) with various connectivity options including USB, HDMI 2.0a, RS-232/485, and Gigabit Ethernet. With 12-24V DC input supply, fanless operation, and a durable steel frame, these compact open-frame panel PCs are meant for space-constrained applications like HMIs, self-service kiosks, gaming consoles, medical terminals, smart vending machines, digital signage, and more. BCM OFT07W-ADLN and OFT10W-ADLN specifications: SoC – Intel Processor N50 dual-core processor up to 3.4 GHz with 6MB cache, 16EU Intel UHD Graphics; TDP: 6W System Memory – Up to 8GB LPDDR5 onboard Storage – [...]

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Waveshare recently launched a series of dot matrix ESL color e-paper displays with Bluetooth and NFC connectivity designed for various IoT, retail, industrial, and similar applications. These Electronic Shelf Label (ESL) displays can be updated through a wireless base station that enables device management using Waveshare’s cloud platform. The displays come with a 1,200mAh coin cell battery which according to Waveshare can last approximately 5 years and support four colors: red, yellow, black, and white. With a wide 178° viewing angle and housed in a durable ABS plastic case, they are ideal for applications such as price tags, shelf labels, asset tracking, and conference name tags. Waveshare ESL color e-paper displays specifications Display technology – E-Paper (Electrophoretic) Display colors – Red, Yellow, Black, White Display sizes – 2.13″, 2.66″, 2.9″, 3.5″ (Dot Matrix) Resolution / Pixel density / Display area 2.13″ – 250 × 122 pixels / 130 DPI / 48.55 × [...]

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SECO has announced early engineering samples for its SOM-SMARC-QCS5430 system-on-module (SoM) and devkit designed to support IoT and edge computing applications. Built around the Qualcomm QCS5430 processor this SMARC-compliant SoM targets industrial automation, robotics, smart cities, and surveillance.

The module also offers dual MIPI-CSI interfaces for camera and connectivity options including USB 3.1, PCIe Gen3, dual GbE, and optional Wi-Fi and Bluetooth. SECO’s DEV-KIT-SMARC industrial devkit includes all the necessary components for rapid prototyping and integration.

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u-blox has recently released the RUBY-W2 series (RUBY-W273-05A and RUBY-W295-05A) of automotive Wi-Fi 7 modules designed for advanced infotainment and telematics applications. These modules support tri-band Wi-Fi 7 and dual-mode Bluetooth 5.4, with up to Gbps (PHY) of throughput, supporting simultaneous use cases for in-car hotspots, Apple CarPlay, and multi-client video streaming. Key features of this module include Multi-Link Operation (MLO) with Dual Band Simultaneous (DBS) and High Band Simultaneous (HBS) modes, 2×2 MU-MIMO, Bluetooth LE Audio, long-range Bluetooth, security with WPA2/3, and secure boot. The modules are based on Qualcomm’s QCA6787AQ or QCA6797AQ automotive chipsets and connect to the host via PCIe for Wi-Fi and UART/PCM for Bluetooth. RUBY-W2 specifications: Chipset Qualcomm QCA6787AQ for RUBY-W273 Qualcomm QCA6797AQ for RUBY-W295) Wireless Tri-band Wi-Fi 7 (802.11 a/b/g/n/ac/ax/be) RUBY-W273 – Dual Band Simultaneous (DBS) (2.4 GHz + 5/6 GHz) RUBY-W295 – High Band Simultaneous (HBS), any two bands (2.4, 5, or 6 [...]

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Taiwan-based company Vecow has recently launched the ECX-4000 series, an Intel Core Ultra 200S-powered fanless Edge AI embedded system with up to nine Ethernet ports including two 10G SFP+ cages, five 2.5GbE ports (with 4 supporting PoE+), and a gigabit Ethernet jack, SUMIT (Stackable Unified Module Interconnect Technology) expansion, and a 9V to 50V DC redundant power input. The ECX-4000 supports the whole line of Intel Core Ultra 200S Series of Processors (Arrow Lake). It comes with W880 PCH which gives access to various I/O options including USB 3.2 Gen 2 ports, RS-232/422/485 serial ports, sixteen isolated digital I/O (8x input, 8x output, optional), DisplayPort, HDMI, and DVI-I video outputs. Additionally, it offers M.2 Key B and Key E sockets for wireless modules, and expansion options including multiple storage interfaces such as SATA III ports and an M.2 Key-M socket. The system also features a range of power and remote [...]

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Luckfox has recently released the Core1106 Core Board Rockchip RV1106 system-on-module with a compact 30x30mm size, 112 castellated pins designed to be soldered on top of a PCB, and an optional WiFi 6 and Bluetooth 5.2 module and IPEX 1.0 antenna connector. The Rockchip RV1106 camera SoC integrates 128MB (G2 version) or 256MB (G3 version) DDR3L memory, a 4th-gen 1 TOPS NPU, and a 3rd-gen Image Signal Processor (ISP) that supports hardware video encoding (H.264/H.265). Other interfaces include MIPI CSI, RGB LCD, USB, Ethernet, GPIO, SPI, I2C, UART, and more. These features make this board suitable for applications like AI-driven image recognition, smart cameras, IoT devices, and edge computing. Luckfox RV1106 system-on-module specifications SoC – Rockchip RV1106G2/G3 CPU – Arm Cortex A7 @ 1.2GHz with an integrated RISC-V co-processor. NPU 4th-gen Rockchip NPU with hybrid quantization (int4, int8, int16) 0.5 TOPS (RV1106G2) or 1 TOPS (RV1106G3) ISP – 3rd-gen 5MP high-performance ISP, HDR, WDR, [...]

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The AAEON BOXER-8654AI-KIT Edge AI kit is a compact development kit built around the NVIDIA Jetson Orin NX modules with four gigabit Ethernet ports (with optional PoE) and an Out-of-Band (OOB) management header, and designed for applications like smart cities, IoT ecosystems, edge AI, and others. The multi-functional carrier board also offers six USB 3.2 Gen 2 ports, HDMI video output, two MIPI CSI, two DB-9 ports for RS-232/422/485 and CAN Bus, and a 40-pin NVIDIA Jetson-compatible GPIO header for I2C, SPI, and UART interfaces. Expansion options include M.2 E and B-key slots for Wi-Fi and 5G modules (with onboard SIM), an M.2 M-Key slot for NVMe SSDs, and a SATA connector. AAEON BOXER-8654AI-KIT specifications SoM – NVIDIA Jetson Orin NX module CPU 8GB Version – 6-core Arm Cortex-A78AE v8.2 64-bit CPU, 1.5MB L2 cache + 4MB L3 cache 16GB Version – 8-core Arm Cortex-A78AE v8.2 64-bit CPU, 2MB L2 [...]

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Portwell PCOM-B887 and PCOM-B886 are two new COM-HPC client modules built around Intel Core Ultra 200S/200U/200H processors delivering high-performance computing and AI acceleration for industrial, edge, and AI-driven applications. The Portwell PCOM-B887 (Size C) module is built around the 200S Series, offers up to 36 TOPS, supports 192GB DDR5 memory, and features 42 PCIe lanes up to Gen5. The PCOM-B886 (Size B) module supports 200H/200U Series processors, which deliver up to 99 TOPS, support 96GB DDR5 memory, and include 24 PCIe lanes. Both modules feature various I/O options, including USB4, USB3.2 Gen2, and multiple display outputs. Portwell PCOM-B887 – COM-HPC Client Type Size C module The PCOM-B887 COM-HPC Client Type Size C module is powered by Intel Core Ultra 200S Series processors, which feature up to 36 TOPS of AI performance via an integrated neural processing unit (NPU). It supports up to 192GB of DDR5 memory at 4800MT/s with 42 [...]

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Designed by Universal Machine Intelligence, the M.2 CAN FD adapter is an M.2 to CAN FD converter board that brings two high-speed CAN FD interfaces to projects requiring reliable high-speed communication. It is an M.2 B-key card with a slim form factor and a breakaway design that supports slot lengths like 2242, 2252, 2260, and 2280. The adapter supports CAN FD and CAN 2.0B protocols with speeds up to 5Mbit/s and includes functional isolation between the host and CAN bus for additional safety. Additional features include a built-in network termination switch with split termination, ultra-low power consumption, and compatibility with 12V, 24V, and 48V systems. Designed for industrial environments, this adapter is ideal for applications like industrial monitoring and control, robotics, production line automation, hardware-in-the-loop testing, remote system access, data logging, and embedded computing. M.2 CAN FD adapter specifications: CAN Bus CAN channel – Dual-channel CAN interfaces that are independent [...]

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Olimex has recently released the PICO2-XL and PICO2-XXL open-source hardware RP2350B development boards with up to 16MB flash, 8MB PSRAM, 48 GPIOs, a microSD card slot, and more. The main difference between the two boards is that the PICO2-XL includes 2MB of external QSPI Flash and a compact flat-bottom design, making it ideal for simpler, space-constrained projects. In contrast, the PICO2-XXL offers 16MB of QSPI Flash, 8MB of PSRAM, and a microSD card slot for expanded storage and performance, catering to more demanding applications like IoT and edge computing. Olimex PICO2-XL and PICO2-XXL specifications SoC – Raspberry Pi RP2350B MCU CPU Dual-core Arm Cortex-M33 @150MHz with Arm Trustzone Dual-core 32-bit Hazard3 RISC-V @ 150MHz Up to two cores can be used at the same time Memory – 520KB SRAM 8kB OTP storage Security – Secure boot Package – QFN-80; 10×10 mm Memory – 8MB PSRAM (PICO2-XXL only) Storage PICO2-XL – [...]

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Jetway MTX-MTH1 is a thin industrial Mini-ITX SBC built around Intel Core Ultra 5/7 Meteor Lake processors with Intel Arc Graphics and support for up to 96GB of DDR5 memory. The most interesting features of this compact board are the three 2.5GbE jacks and four HDMI 2.1 video outputs for 4K and 8K displays. Additionally, it features multiple USB ports, a PCIe Gen 5 x8 slot, M.2 slots for storage and 4G LTE/5G, serial ports, and GPIO interfaces. With industrial environmental tolerance (-20°C to 60°C) this thin Mini-ITX motherboard is ideal for industrial automation, AI processing, edge computing, and embedded systems. Jetway MTX-MTH1 specifications: SoC (one or the other) Intel Core Ultra 7 Processor 155H (Meteor Lake, TDP 28W) with Intel Arc Graphics Intel Core Ultra 5 Processor 125H (Meteor Lake, TDP 28W) with Intel Arc Graphics System Memory – 2x DDR5 5600MHz SO-DIMM, up to 96GB Storage SATA III [...]

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Waveshare has recently launched DDSM Driver HAT (B), a compact Raspberry Pi DDSM (Direct Drive Servo Motor) motor driver designed specifically to drive the DDSM400 hub motors. This board is built around an ESP32 MCU and supports wired (USB and UART) and wireless (2.4GHz WiFi) communication. Additionally, the board features a physical toggle switch, which lets it choose between the ESP32 control or USB control modes. On ESP32 control mode you can control the device through a built-in web application. In the USB control mode, the motor driver can be controlled via USB from a host computer sending JSON commands. An XT60 connector is used to power the board, and programming is done through a USB-C port that connects to the ESP32. The board is suitable for robotics projects, especially for mobile robots in 6×6 or 4×4 configurations. Waveshare DDSM Driver HAT (B) specifications: Wireless MCU – Espressif Systems ESP32-WROOM-32E ESP32 [...]

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Waveshare ESP32-S3-Touch-AMOLED-1.8 is an ESP32-S3 development board with an AMOLED display and AI audio support fully housed in a plastic enclosure. The most interesting feature of this devkit is its 1.8-inch AMOLED display with a 100000:1 contrast ratio and a wide 178° viewing angle, plus support for AI speech using its built-in microphone and speaker, and a built-in battery for IoT and AI applications. Other features include a QMI8658 6-axis IMU for motion detection, a PCF85063 RTC for time, and an ES8311 audio codec for high-quality audio. The ESP32-S3 provides Bluetooth and Wi-Fi connectivity and the board also features a USB-C port for power and programming. The AXP2101 power management IC enables battery charging and optimization, while GPIO, I2C, and UART pads allow expansion. Waveshare ESP32-S3-Touch-AMOLED-1.8 specifications Wireless MCU – Espressif Systems ESP32-S3R8 CPU – Dual-core Tensilica LX7 @ up to 240 MHz with vector instructions for AI acceleration. Memory – [...]

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In response to community feedback for more I/O options, Seeed Studio has recently launched the Seeed Studio XIAO Plus series with 23 castellated mounting pins (20 GPIOs, 3 power pins) and improved back solder points, improving compatibility with carrier boards for complex projects. The new series includes the XIAO ESP32S3 Plus, XIAO nRF52840 Plus, and XIAO nRF52840 Sense Plus which are direct upgrades of the XIAO ESP32S3, XIAO nRF52840 BLE, and XIAO nRF52840 Sense boards. The new design allows for easier assembly and scalable production, with double the I/O options. XIAO ESP32S3 Plus The Seeed Studio XIAO ESP32S3 Plus is a compact development board with a total of 23 pins on the board out of which 11 are through-hole GPIO pins 9 additional SMD castellations GPIO pins and 3 through-hole are power pins. The board is built around an ESP32-S3 MCU so it has 2.4GHz WiFi and BLE 5.0 connectivity. Other [...]

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California-based company GuRu Wireless has recently developed and showcased a scalable and modular wireless power transfer system that is capable of delivering power to a high-power device up to several kilowatts, such as a drone, from up to 30 feet away (a little over 9 meters). They also mention that the system can power low-power devices, like LEDs and consumer electronics, over distances of several kilometers. It’s quite an extension to the GuRu’s desk-range wireless power evaluation kit we covered in 2020. The system uses 24 GHz high-frequency millimeter-wave radio signals to deliver energy over long distances without needing batteries or tethered systems. GuRu’s system uses a phased array transmitter with proprietary RFICs, to precisely deliver power to the receiver called the Recovery Unit (RU). In a recent demonstration video, GuRu Wireless showcased their wireless power transfer system by powering a drone from 30 feet away, operating it continuously for [...]

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