Arduino has introduced the Portenta Proto Kit ME (Motion Environment) at CES 2025 with the kit designed to allow engineers, designers, and innovators to turn ideas into functional prototypes quickly. The kit does not include new hardware, but it is based on the Arduino Portenta H7, Mid Carrier, and Nicla Sense ME module, as well as other off-the-shelf parts such as a 4G LTE and GNSS module and some Modulino modules, plus three months of Arduino Cloud access. The company expects the prototyping kit to be used for predictive maintenance, environmental sensing, and industrial automation prototypes. Arduino Portenta Proto Kit ME kit content: Portenta H7  board based on STMicro STM32H747 Arm Cortex-M7 @ 480 MHz + M4 @ 200 MHz MCU capable of handling ML workloads and advanced processing Portenta Mid Carrier with gigabit Ethernet, USB 2.0 port, MIPI CSI and Arduino camera connectors, CAN Bus, mPCIe socket, GPIO header, [...]

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The HDMI Forum and VESA had announcements for the upcoming HDMI 2.2 and DisplayPort 2.1b respectively at CES 2025 mostly to introduce future cables supporting higher bandwidth of up to 96 Gbps for the Ultra96 HDMI cable and 80Gps for the DP80LL cables. HDMI 2.2 and Ultra96 cable We don’t have that many details yet, and both were announcements about the future release of specifications. HDMI Forum explained that version 2.2 of HDMI specification will handle up to 96Gbps bandwidth (double the 48Gbps supported by HDMI 2.1) and support next-gen HDMI Fixed Rate Link technology to “provide optimal audio and video for a wide range of device applications” as well as Latency Indication Protocol (LIP) for improving audio and video synchronization, notably in audio video receivers or soundbars. The higher bandwidth will be especially useful for data-intensive, immersive, and virtual applications such as AR/VR/MR, spatial reality, and light field displays, [...]

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Following new SoC announcements by Intel and AMD at CES 2025, ASRock Industrial has launched the NUC(S) Ultra 200 BOX Series and NUC Ultra 200 Motherboard Series powered by Intel Core Ultra 200H Arrow Lake-H processors with of to 99 TOPS of AI inferencing power, and the 4X4 BOX AI300 Series and 4X4 AI300 Motherboard Series based on  AMD Ryzen AI 300 processors with up to 50 TOPS of NPU performance. ASROCK NUC(S) Ultra 200 BOX PCs & NUC ULTRA 200 motherboards NUC(S) Ultra 200 specifications: Arrow Lake-H/U SoC (one or the other) Intel Core Ultra 7 255H (6P+8E) processor up to 5.1 GHz with 24MB cache, Intel Arc 140T GPU (74 TOPS), and Intel AI Boost (13 TOPS); PBP: 28 Watts Intel Core Ultra 5 225H (4P+8E) processor up to 4.9 GHz with 18MB cache, Intel Arc 130T GPU (63 TOPS), and Intel AI Boost (13 TOPS); PBP: 28 [...]

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Qualcomm has unveiled the Snapdragon X octa-core Arm SoC at CES 2025 designed for mainstream AI PCs with Copilot+, which should start at $600 and up. This follows the announcements of the high-end 4.3GHz Snapdragon X Elite 12-core SoC in 2023, and the Snapdragon X Plus 10-/8-core processors last year, and should make AI PCs affordable to a wider range of consumers. The new Snapdragon X is clocked at up to 3.0 GHz, still features a 45 TOPS Hexagon NPU, supports NVMe storage, up to 64GB LPDDR5,  up to 2560 x 1440 built-in displays, up to three external displays at 4Kp60, and a single camera up to 36MP resolution. Systems based on the new octa-core processor can support WiFi 7, WiFi 6E, and/or 5G LTE connectivity. Qualcomm Snapdragon X (X1-26-100) specifications: CPU – Octa-core 64-bit Armv8 Oryon processor clocked at up to 3.0 GHz (2976 MHz) with 30MB cache GPU [...]

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