Starting with the GD32G553 SKUs, the 216 MHz GigaDevice GD32G5 high-performance Arm Cortex-M33 microcontroller family features 256KB to 512KB of embedded Flash with dual-bank Flash support, 128KB of SRAM, and a range of hardware accelerators including a DSP, single-precision FPU, a trigonometric function accelerator (TMU), and other hardware acceleration units, filter algorithms (FAC) and Fast Fourier Transform (FFT). Designed for industrial applications, the GD32G5 microcontrollers also offer a wide range of digital and analog interfaces and enhanced security capabilities suitable for digital power systems, charging stations, energy storage inverters, frequency converters, servo motors, and optical communication. GigaDevice GD32G5 specifications: MCU Core – Arm Cortex-M33 Armv8-M core clocked at up to 216MHz with DSP instruction set and single-precision FPU; up to 316 DMIPS, CoreMark score: 694. Memory/Storage 128KB SRAM (80KB SRAM0 + 16KB SRAM1 + 32KB TCMSRAM) 256KB to 512KB on-chip flash, QSPI interface for external storage External memory controller (EXMC) [...]

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NXP i.MX 94 is an octa-core Arm SoC with up to four Cortex-A55 application cores, two Arm Cortex-M33 real-time/functional safety cores, two Arm Cortex-M7 real-time/functional safety cores, and an NXP eIQ Neutron NPU designed for Edge AI industrial and automotive applications I initially thought it would be a cost-down version of the NXP i.MX 95, and while it shares many of the same features, it’s more an application-specific processor designed specifically for industrial and automotive applications, lacking a 3D GPU, camera input interfaces, a MIPI DSI display interface, and 10GbE networking, but increasing the number of real-time cores (at the cost of application cores) and adding several networking features such as an Ethernet time-sensitive networking (TSN) switch, 2.5GbE interface, an Ethercat controller, and support for industrial protocols like Profinet or OPC-UA FX. NXP i.MX 94 specifications: CPU Up to 4x Arm Cortex-A55 cores 2x Arm Corex-M7 cores, one for functional [...]

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The NXP RW612 is an Arm Cortex-M33 SoC with three radios, namely WiFi 6, Bluetooth 5.4, and 802.15.4 for Thread and Matter connectivity. It also has a small sibling called the RW610 without the 802.15.4 radio. I first came across RW61x chips, when Debashis wrote about the Trimension SR250 UWB chip mentioning it can work with “host processors like NXP’s i.MX, RW61x, and MCX families”. I initially thought it was a typo for the iW612 tri-radio solution introduced in 2022, and the RW612 is indeed similar, but it’s a complete wireless microcontroller/SoC with an Arm Cortex-M33 application core so it can be used independently as a host instead of a companion chip. NXP RW612 and RW610 specifications: MCU sub-system Core – 260 MHz Arm Cortex-M33 with TrustZone-M Memory On-chip 1.2 MB SRAM PSRAM interface for memory expansion Storage – Quad FlexSPI Flash XIP with on-the-fly decryption Peripheral interfaces Up to [...]

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NXP has recently announced the release of  NXP i.MX RT700 RT700 AI crossover MCU following the NXP i.MX RT600 series release in 2018 and the i.MX RT500 series introduction in 2021. The new i.MX RT700 Crossover MCU features two Cortex-M33 cores, a main core clocked at 325 MHz with a Tensilica HiFi 4 DSP and a secondary 250 MHz core with a low-power Tensilica HiFi 1 DSP for always-on sensing tasks. Additionally, it integrates a powerful eIQ Neutron NPU with an upgraded 7.5 MB of SRAM and a 2D GPU with a JPEG/PNG decoder. These features make this device suitable for applications including AR glasses, hearables, smartwatches, wristbands, and more. NXP i.MX RT700 specifications: Compute subsystems Main Compute Subsystem Cortex-M33 @ up to 325 MHz with Arm TrustZone, built-in Memory Protection Unit (MPU), a floating-point unit (FPU),  a HiFi 4 DSP and supported by NVIC for interrupt handling and SWD [...]

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