Qualcomm has added two new IoT modules to its wireless connectivity product series: the Qualcomm QCC730M ‘micro-power’ WiFi 4 module and the QCC74xM tri-radio module, with both modules designed for smart homes, smart appliances, medical devices, and industrial applications. The Qualcomm QCC730M is a dual-band, micro-power Wi-Fi 4 module with a 60MHz Arm Cortex-M4F MCU, 640kB SRAM, 1.5MB RRAM, hardware crypto accelerator, and secure boot, debug, and storage. Its low-power design is ideal for portable, battery-powered IoT devices like IP cameras, sensors, and smart locks. Based on the Qualcomm QCC730 module, it features a 36-pin LGA package with a PCB antenna or RF connector and supports up to 4MB of optional NOR flash. The Qualcomm QCC74xM is Qualcomm’s “first programmable connectivity module,” integrating a 32-bit RISC-V module, optional stacked memory (PSRAM and NOR flash), and a tri-radio chipset for WiFi 6, Bluetooth 5.3, and IEEE 802.15.4 (Thread and Zigbee). Its [...]

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NXP i.MX 94 is an octa-core Arm SoC with up to four Cortex-A55 application cores, two Arm Cortex-M33 real-time/functional safety cores, two Arm Cortex-M7 real-time/functional safety cores, and an NXP eIQ Neutron NPU designed for Edge AI industrial and automotive applications I initially thought it would be a cost-down version of the NXP i.MX 95, and while it shares many of the same features, it’s more an application-specific processor designed specifically for industrial and automotive applications, lacking a 3D GPU, camera input interfaces, a MIPI DSI display interface, and 10GbE networking, but increasing the number of real-time cores (at the cost of application cores) and adding several networking features such as an Ethernet time-sensitive networking (TSN) switch, 2.5GbE interface, an Ethercat controller, and support for industrial protocols like Profinet or OPC-UA FX. NXP i.MX 94 specifications: CPU Up to 4x Arm Cortex-A55 cores 2x Arm Corex-M7 cores, one for functional [...]

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In 2022, we covered Intel’s Xeon D (Ice Lake-D) processor family, which includes the D-2700 and D-1700 models. These processors are designed for software-defined networking and edge applications, providing data center-grade capabilities at the edge. Key features include integrated AI and crypto acceleration, built-in Ethernet, and support for Intel Time Coordinated Computing (TCC) and Time-Sensitive Networking (TSN) to ensure high reliability. Leveraging these advanced capabilities, companies like ADLINK Technology and Congatec have introduced COM-HPC server modules and COM Express Type 7 modules based on the new Xeon D lineup. Axiomtek’s CEM710 is a COM Express Type 7 Basic Module powered by Intel Xeon D-1700 Series processors, designed for edge computing, industrial automation, and data-intensive applications. It offers up to 10 cores, 100Gbps Ethernet, and 64GB of DDR4 ECC memory, along with PCIe Gen3 slots for expandability. With rugged features and TPM 2.0 for security, it ensures reliable performance in demanding [...]

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Microchip recently released the PIC32MZ-W1 wireless MCU along with 20 other WiFi parts, including WiFi MCUs, link controllers, network controllers, and plug-and-play modules. Among them, the PIC32MZ-W1 wireless MCU is the most interesting because of its 32-bit MIPS microAptiv M-class core running at up to 200MHz, advanced hardware security features, and integrated Microchip Trust Platform for secure cloud authentication. Over the years ESP32 MCUs have become the go-to choice for wireless applications. Still, one problem we always have with ESP32 SoCs is their limited GPIO option due to their strapped-out pin structures. But this new MCU has over 60 GPIO pins to work with along with Ethernet MAC, USB, CAN Bus, CANFD, SPI, I2C, SQI, UART, ADC, JTAG, and more. PIC32MZ-W1 wireless MCU specifications MCU MIPS32 M-Class core clocked at 200 MHz 16KB I-Cache, 16KB D-Cache microMIPS mode (up to 35% smaller code size) DSP extensions (4x 64-bit accumulators, single-cycle [...]

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Wiznet has recently released the W55RP20-EVB-Pico dev board, a compact board based around the W55RP20 SiP that fuses the Raspberry Pi RP2040 MCU and the W5500 Ethernet controller into a single IC, plus a 2MB flash chip for firmware storage. Just last month we wrote about W5100S-EVB-Pico2 and W5500-EVB-Pico2 dev boards, both the boards have a newer Raspberry Pi RP2350 MCU and external Ethernet controller (W5500 or W5100S). The RP2350 offers additional security features such as One Time Programmable (OTP) memory, secure boot, and Arm TrustZone technology, making it more suitable for secure applications. The W55RP20 on the other hand integrates a W5500 Ethernet controller and the RP2040 in a single SiP which is also pin-compatible with the Raspberry Pi Pico, making it easy to use existing Pico accessories and code examples. W55RP20-EVB-Pico dev board specifications: SiP– W55RP20 microcontroller MCU – Raspberry Pi RP2040 Core– Dual Cortex M0+ cores up [...]

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The NXP RW612 is an Arm Cortex-M33 SoC with three radios, namely WiFi 6, Bluetooth 5.4, and 802.15.4 for Thread and Matter connectivity. It also has a small sibling called the RW610 without the 802.15.4 radio. I first came across RW61x chips, when Debashis wrote about the Trimension SR250 UWB chip mentioning it can work with “host processors like NXP’s i.MX, RW61x, and MCX families”. I initially thought it was a typo for the iW612 tri-radio solution introduced in 2022, and the RW612 is indeed similar, but it’s a complete wireless microcontroller/SoC with an Arm Cortex-M33 application core so it can be used independently as a host instead of a companion chip. NXP RW612 and RW610 specifications: MCU sub-system Core – 260 MHz Arm Cortex-M33 with TrustZone-M Memory On-chip 1.2 MB SRAM PSRAM interface for memory expansion Storage – Quad FlexSPI Flash XIP with on-the-fly decryption Peripheral interfaces Up to [...]

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NXP has recently announced the release of  NXP i.MX RT700 RT700 AI crossover MCU following the NXP i.MX RT600 series release in 2018 and the i.MX RT500 series introduction in 2021. The new i.MX RT700 Crossover MCU features two Cortex-M33 cores, a main core clocked at 325 MHz with a Tensilica HiFi 4 DSP and a secondary 250 MHz core with a low-power Tensilica HiFi 1 DSP for always-on sensing tasks. Additionally, it integrates a powerful eIQ Neutron NPU with an upgraded 7.5 MB of SRAM and a 2D GPU with a JPEG/PNG decoder. These features make this device suitable for applications including AR glasses, hearables, smartwatches, wristbands, and more. NXP i.MX RT700 specifications: Compute subsystems Main Compute Subsystem Cortex-M33 @ up to 325 MHz with Arm TrustZone, built-in Memory Protection Unit (MPU), a floating-point unit (FPU),  a HiFi 4 DSP and supported by NVIC for interrupt handling and SWD [...]

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